Sinomer® UVD 52001 DCM is a dual-cure epoxy methacrylate 低聚物 containing one epoxy group and one methacrylate double bond in the same molecule. This unique structure enables two independent curing mechanisms: free-radical UV polymerization through the methacrylate group, and cationic or thermal ring-opening polymerization through the epoxy group. The dual-cure capability allows for shadow-area curing, post-curing, and enhanced crosslink 密度, making it suitable for demanding adhesive, coating, ink, and sealant applications. It exhibits high reactivity, excellent chemical resistance, 高硬度, and good abrasion resistance.
SINOMER® UVD52001 DCM
(Dual-Cure Epoxy Methacrylate 低聚物)
Sinomer® UVD 52001 DCM is a dual-cure epoxy methacrylate 低聚物 containing one epoxy group and one methacrylate double bond in the same molecule. This unique structure enables two independent curing mechanisms: free-radical UV polymerization through the methacrylate group, and cationic or thermal ring-opening polymerization through the epoxy group. The dual-cure capability allows for shadow-area curing, post-curing, and enhanced crosslink 密度, making it suitable for demanding adhesive, coating, ink, and sealant applications. It exhibits high reactivity, excellent chemical resistance, 高硬度, and good abrasion resistance.
外观 | Slightly green 透明液体 |
粘度 (mPa·s @ 25°C) | 85,000 – 130,000 |
Acid Value (mg KOH/g) | ≤ 3.0 |
Functionality | 2 |
Dual-cure functionality: free-radical (methacrylate) + cationic/thermal (epoxy)
High reactivity and 快速固化
Excellent chemical resistance
高硬度 and good abrasion resistance
Good 附着力 to glass, optical materials, metals, plastics, wood, and paper
Suitable for anaerobic, structural, and pressure-sensitive adhesives
Anaerobic adhesives
Structural adhesives
Pressure-sensitive adhesives
Coatings
Inks
Sealants
Bonding and coating of glass, optical materials, metals, plastics, wood, and paper
20 公斤 or 200 公斤/桶.
存放于干燥、清洁、通风良好的仓库中.
避免受光照和受热.
运输过程中防止泄漏、雨淋和曝晒.
