AgeSin®SPA-TDPS

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AgeSin®SPA-TDPS

Thiazolinyl dithio propane sulfonate, CAS 8106-00-1, PCB copper plating additive, grain refiner

AgeSin®SPA-TDPS is a high-purity, water-soluble organic compound primarily used as an advanced additive in electroplating baths. It is particularly effective in the copper electroplating process for printed circuit boards (PCBs).


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AgeSin®SPA-TDPS

(PCB Copper Plating Intermediate)

Chemical Name: Thiazolinyl dithio propane sulfonate

CAS No.: 8106-00-1

MF: C6H11NO3S4 MW: 273.42

Molecular structure:

噻唑啉基二硫代丙烷磺酸钠 结构式


产品概述 :

AgeSin®SPA-TDPS is a high-purity, water-soluble organic compound primarily used as an advanced additive in electroplating baths. It is particularly effective in the copper electroplating process for printed circuit boards (PCBs).


出厂标准 :

Item

Specification

Appearance (25°C)

White to light yellow powder

Purity (%)

> 98%

Water Solubility (20°C)

Freely soluble in water

Dosage

0.5 - 0.8 KAH


应用体系 :
  • Significantly enhances the tensile strength of electrodeposited copper foil.

  • Functions as a combined grain refiner and leveling agent, resulting in a smooth and fine-grained copper deposit.

  • Its performance is similar to SPS (Bis-(3-sulfopropyl)-disulfide,Cas No.27206-35-5), but it is uniquely designed as a synergistic product that integrates both grain refinement and leveling properties.

  • This technology is specifically recommended for PCB copper plating applications.

包装 :

25kgs/drum.

贮存 :

Being kept in dry, clean warehouse with well ventilation.

Avoid exposing to light and heating.

运输过程中防止泄漏、雨淋和曝晒。

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